宇邦新材：公司的锡膏产品目前主要应用在光伏行业的BC电池组件封装焊接

证券之星06-24

证券之星消息，宇邦新材(301266)06月23日在投资者关系平台上答复投资者关心的问题。

投资者提问：尊敬的董秘，您好！请问公司的锡膏产品有没有在向半导体行业拓展？有没有尝试向一些半导体相关公司提交样品，认证等工作？谢谢！

宇邦新材回复：尊敬的投资者，您好！公司的锡膏产品目前主要应用在光伏行业的BC电池组件封装焊接，锡膏产品的营收规模在公司整体营收中占比较小，尚未向半导体行业拓展，谢谢！

本文数据来源于深圳证券交易所互动易，仅供参考不构成投资建议。

责任编辑：沈彬

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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