晶升股份：半导体晶体生长设备总装测试厂区建设项目预计于下半年开工建设

证券之星06-22

证券之星消息，晶升股份(688478)06月22日在投资者关系平台上答复投资者关心的问题。

投资者提问：目前订单已把产能排满到10月底，已经在筹备扩建新厂，请问是否属实？

晶升股份回复：尊敬的投资者，您好！公司整体产能利用率较去年同期出现明显回升。公司募投项目“半导体晶体生长设备总装测试厂区建设项目”预计于下半年开工建设。感谢您的关注!

本文数据来源于上海证券交易所e互动，仅供参考不构成投资建议。

责任编辑：沈彬

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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