胜宏科技：具备100层以上高多层PCB技术能力

证券之星06-17 09:01

证券之星消息，胜宏科技(300476)06月17日在投资者关系平台上答复投资者关心的问题。

投资者提问：尊敬的董秘，您好！请问贵公司正交背板技术储备如何，有没有相关产能准备和投产计划？

胜宏科技回复：尊敬的投资者，您好！受商业政策限制，未经许可公司不便讨论具体客户名称及业务情况，敬请谅解。公司具备100层以上高多层PCB、10阶30层HDI与16层任意互联（Any-layer） HDI的技术能力，并积极推进下一代14阶36层HDI的研发认证。公司始终与客户保持密切沟通，全力配合新产品的研发相关工作。具体产品的量产时间节点将结合技术研发进度与客户需求综合确定。谢谢关注！

本文数据来源于深圳证券交易所互动易，仅供参考不构成投资建议。

相关 ETF

责任编辑：陈思雨

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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