南京聚隆：2025年公司组建芯片封装材料业务专项研发团队

证券之星06-18

证券之星消息，南京聚隆(300644)06月17日在投资者关系平台上答复投资者关心的问题。

投资者提问：尊敬的董秘您好！请问公司在半导体芯片封装材料领域研发有哪些进展，未来有哪些规划？

南京聚隆回复：尊敬的投资者您好！2025年公司组建芯片封装材料业务专项研发团队，目前处于前期技术探索与研发阶段，尚未与客户形成合作供货。感谢您的关注！

本文数据来源于深圳证券交易所互动易，仅供参考不构成投资建议。

责任编辑：沈彬

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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