汤臣倍健(300146.SZ)拟5000万元投资原粒(北京)半导体将持有其0.97%的股权

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智通财经APP讯，汤臣倍健(300146.SZ)发布公告，公司拟以自有资金5000万元投资原粒(北京)半导体技术有限公司，本次投资完成后，公司将持有其0.97%的股权。本次投资属于财务性投资，半导体领域是科技创新的重要方向，公司旨在通过投资布局建立对于前沿科技领域的认知窗口，分享科技企业成长带来的中长期价值提升，为公司及股东创造良好的财务回报，符合股东利益及国家创新驱动发展战略。

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汤臣倍健(300146.SZ)拟5000万元投资原粒(北京)半导体 将持有其0.97%的股权

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汤臣倍健(300146.SZ)拟5000万元投资原粒(北京)半导体将持有其0.97%的股权