凯盛科技：球形硅微粉用于电子封装、5G高频高速覆铜板、特种陶瓷等领域

证券之星06-18

证券之星消息，凯盛科技(600552)06月18日在投资者关系平台上答复投资者关心的问题。

投资者提问：请问：贵司在球硅和陶瓷方面有什么产品或技术应用

凯盛科技回复：尊敬的投资人，您好，公司球形硅微粉主要用于电子封装、5G高频高速覆铜板、特种陶瓷等领域，氧化锆系列产品可用于陶瓷领域，包括结构陶瓷、先进陶瓷、电子陶瓷以及陶瓷色釉料等，感谢您的关注。

本文数据来源于上海证券交易所e互动，仅供参考不构成投资建议。

责任编辑：沈彬

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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