太极实业：目前公司半导体业务不涉及HBM产品

证券之星06-18

证券之星消息，太极实业(600667)06月18日在投资者关系平台上答复投资者关心的问题。

投资者提问：请问：AI模型讲其无锡基地HBM3E封装月产能已达12万片，占据全球约15%的市场份额，且8层堆叠良率超过99%。这是真的吗？

太极实业回复：敬的投资者您好！目前公司半导体业务不涉及HBM产品。感谢您的关注与支持。

本文数据来源于上海证券交易所e互动，仅供参考不构成投资建议。

责任编辑：刘浩然

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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