中科飞测：量产设备覆盖HBM、2.5D/3D封装领域头部客户需求

证券之星06-18

证券之星消息，中科飞测(688361)06月18日在投资者关系平台上答复投资者关心的问题。

投资者提问：董秘您好，贵企业在针对IC先进封装工艺中晶圆凸块、铜柱等类型，RDL、TSV等工艺等典型3D特征和2D关键尺寸及缺陷检测的量检测系统，研发进展如何，是否已经出货，客户端是否已经稳定量产。谢谢

中科飞测回复：您好，感谢您对公司的关注。公司的量产设备已经覆盖国内HBM、2.5D/3D封装领域头部客户对于量检测的全部需求，包括暗场纳米图形晶圆缺陷检测设备、无图形晶圆缺陷检测设备、图形晶圆缺陷检测设备、三维形貌量测设备、套刻精度量测设备、介质膜厚量测设备等量产设备，这些设备在先进封装收入中占有很高比例。

本文数据来源于上海证券交易所e互动，仅供参考不构成投资建议。

相关 ETF

责任编辑：刘浩然

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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