容大感光：截至目前公司尚未涉及芯片底部填充胶产品的研发与生产

证券之星06-15 17:30

证券之星消息，容大感光(300576)06月15日在投资者关系平台上答复投资者关心的问题。

投资者提问：您好董秘，请问公司有生产芯片底部填充胶的规划或者产品吗？谢谢

容大感光回复：您好！截至目前，公司尚未涉及芯片底部填充胶产品的研发与生产，亦无相关规划，感谢您的关注！

本文数据来源于深圳证券交易所互动易，仅供参考不构成投资建议。

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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