汇成股份：未涉及玻璃基板封装相关工艺或技术

证券之星06-15

证券之星消息，汇成股份(688403)06月15日在投资者关系平台上答复投资者关心的问题。

投资者提问：董秘您好：贵公司有玻璃基板封装工艺或者封装业务？

汇成股份回复：尊敬的投资者您好！公司主营业务为集成电路封装测试服务，主要为客户提供显示驱动芯片全制程封装测试统包服务。公司现有业务制程中玻璃覆晶封装（COG）主要包括晶圆研磨、减薄、切割等工艺环节，未涉及玻璃基板封装相关工艺或技术，公司亦暂无涉足玻璃基板封装或相关领域的计划。感谢您的关注。

本文数据来源于上海证券交易所e互动，仅供参考不构成投资建议。

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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