同兴达：显示驱动芯片金凸块全流程封测项目正在发展中

证券之星06-09

证券之星消息，同兴达(002845)06月08日在投资者关系平台上答复投资者关心的问题。

投资者提问：请问董秘，日月同芯目前储备的混合键合及TSV技术，是否具备承接“韬定律”相关逻辑折叠芯片封测的能力？公司与战略股东日月光在先进封装技术上是否有深度的协同研发或订单导入？未来是否会拓展除显示驱动以外的AI及高性能计算封测业务？感谢回答！

同兴达回复：您好，感谢对我司的关注。我司与昆山日月新合作的显示驱动芯片金凸块全流程封测项目正在发展中；我司会时刻关注行业发展，做好业务规划及技术储备，谢谢！

本文数据来源于深圳证券交易所互动易，仅供参考不构成投资建议。

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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