深南电路：FC-BGA类封装基板已实现22层及以下产品量产

证券之星06-09

证券之星消息，深南电路(002916)06月09日在投资者关系平台上答复投资者关心的问题。

投资者提问：您好，请问公司在ABF载板（FCBGA）方面的产能情况如何？无锡工厂、广州一期现在分别达产多少了

深南电路回复：尊敬的投资者，您好。目前公司广州基板工厂仍处于产能爬坡阶段，FC-BGA类封装基板已实现22层及以下产品量产，24层及以上产品技术研发及打样工作按期推进。受益于存储及应用处理器芯片类封装基板需求拉动，无锡基板工厂产能利用率延续2025年四季度以来的较高水平。谢谢您的关注。

本文数据来源于深圳证券交易所互动易，仅供参考不构成投资建议。

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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