晶方科技：公司为全球12英寸车规CIS晶圆级TSV封装技术的开拓者

证券之星06-12 16:21

证券之星消息，晶方科技(603005)06月12日在投资者关系平台上答复投资者关心的问题。

投资者提问：公司车归cis全球市场占有率大概多少，全球出货量4.8亿颗，公司占比大概30%

晶方科技回复：您好，近年来随着汽车智能化的快速发展，车规CIS市场需求快速增长。公司为全球12英寸车规CIS晶圆级TSV封装技术的开拓者，技术创新、生产能力与市场占有领先优势显著，谢谢您的关注。

本文数据来源于上海证券交易所e互动，仅供参考不构成投资建议。

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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