光力科技：公司半导体业务核心产品为切、磨、抛工艺所需的高精密设备及耗材

证券之星06-10

证券之星消息，光力科技(300480)06月09日在投资者关系平台上答复投资者关心的问题。

投资者提问：请问贵司的产品和技术是否已经用在国产6代机上？

光力科技回复：感谢您的关注！公司半导体业务核心产品为切、磨、抛工艺所需的高精密设备及耗材，主要服务半导体后道封测领域，可覆盖晶圆切割、封装体切割、晶圆减薄等主流工艺，下游客户以半导体封装测试服务商（OSAT）与垂直整合制造厂商（IDM）为主，谢谢！

本文数据来源于深圳证券交易所互动易，仅供参考不构成投资建议。

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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