华海清科：CMP是实现全局平坦化的核心与关键工序

证券之星06-05

证券之星消息，华海清科(688120)06月05日在投资者关系平台上答复投资者关心的问题。

投资者提问：先进封装半导体TGV玻璃基板是否必须使用CMP机械抛光工艺，公司的设备是否完全可以满足先进封装的需求！请公司及时回复投资者的提问！谢谢

华海清科回复：尊敬的投资者您好！在先进封装TGV工艺中，通孔金属化后会产生表面多余金属层及表面不平整，为确保后续工序对准精度与多层布线的可靠性，CMP是实现全局平坦化的核心与关键工序。当前国内AI技术在算法架构、算力密度等核心维度持续突破，带动先进封装与芯片堆叠技术迎来深层发展机遇，公司CMP装备、减薄装备、划切装备、边抛装备等产品应用场景将持续拓宽，为公司实现持续高速增长注入强劲动能。未来，公司将结合自身业务发展情况，密切跟踪半导体行业技术演进趋势，持续推进产品技术迭代与品类拓展，致力于为客户提供更先进、更多元化的装备解决方案。敬请各位投资者注意投资风险、理性投资。感谢您对公司的关注！

本文数据来源于上海证券交易所e互动，仅供参考不构成投资建议。

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免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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