道生天合：公司产品未应用于半导体玻璃基板叠层领域

证券之星06-08

证券之星消息，道生天合(601026)06月08日在投资者关系平台上答复投资者关心的问题。

投资者提问：公司粘胶产品可用于玻璃基板叠层？

道生天合回复：您好！公司的高性能特种粘胶剂及树脂材料目前主要广泛应用于风电叶片、新能源汽车、消费电子及轨道交通等核心领域。截至目前，公司产品未应用于半导体玻璃基板叠层领域。公司的经营及重大信息均以在法定信息披露媒体上刊登的公告为准。感谢您的关注，敬请广大投资者理性投资，注意风险！

本文数据来源于上海证券交易所e互动，仅供参考不构成投资建议。

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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