隆华新材：CASE用聚醚可用于制备微电子封装点胶

证券之星16:36

证券之星消息，隆华新材(301149)06月01日在投资者关系平台上答复投资者关心的问题。

投资者提问：高管你好！公司产品是否已在芯片和半导体领域商用？如有，请回复是什么产品？谢谢！

隆华新材回复：公司CASE用聚醚可用于制备微电子封装点胶，端氨基聚醚产品可用于电子封口胶固化剂、电子灌封料固化剂、电子包封料固化剂。公司产品至下游终端产品之间尚存在较多加工制造环节，具体使用场景由下游客户根据自身需求确定。感谢您的关注！

本文数据来源于深圳证券交易所互动易，仅供参考不构成投资建议。

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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