联芸科技：目前公司SSD主控芯片产品可适配2D/3D NAND闪存颗粒

证券之星06-04

证券之星消息，联芸科技(688449)06月04日在投资者关系平台上答复投资者关心的问题。

投资者提问：请问公司的主控芯片是否适配适配堆叠方案？

联芸科技回复：目前公司SSD主控芯片产品可适配2D/3D NAND闪存颗粒、可覆盖常温/宽温使用场景、可适用于有缓存/无缓存解决方案（DRAM/DRAMLESS）。公司将实时关注下游产业发展与下一代存储技术演进趋势，启动相关产品的技术预研，并择机推出适配新技术、新标准的芯片产品。

本文数据来源于上海证券交易所e互动，仅供参考不构成投资建议。

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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