宏明电子：该材料配方、参数针对MLCC工况定制，不能用于玻璃基板的通孔填充

证券之星06-04 08:42

证券之星消息，宏明电子(301682)06月03日在投资者关系平台上答复投资者关心的问题。

投资者提问：您好！公司年报中提到的在设计验证的“MLCC用陶瓷介质材料及电极浆料”能解决通孔填充致密性与匹配性难题，实现层间电极可靠性互联。请问这种产品或材料可以用于玻璃基板的通孔填充吗？谢谢回答。

宏明电子回复：尊敬的投资者，您好！公司研发的MLCC配套陶瓷介质与电极浆料，研发攻关聚焦MLCC电容产品体系。该材料配方、参数针对MLCC工况定制，不能用于玻璃基板的通孔填充。感谢您的关注！

本文数据来源于深圳证券交易所互动易，仅供参考不构成投资建议。

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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