濮阳惠成：顺酐酸酐衍生物广泛应用于电子元器件封装材料

证券之星06-04

证券之星消息，濮阳惠成(300481)06月04日在投资者关系平台上答复投资者关心的问题。

投资者提问：董秘您好，ABF载板核心材料为ABF膜环氧固化体系，公司酸酐固化剂是否直接参与ABF配方体系？与味之素ABF配套的固化剂，公司是否已有样品或送样？在半导体封装材料国产替代趋势下，公司在载板方向的产能规划与客户拓展节奏是怎样的？

濮阳惠成回复：尊敬的投资者您好，公司顺酐酸酐衍生物产品广泛应用于电子元器件封装材料、电气设备绝缘材料、风电领域、复合材料、涂料等诸多领域。感谢您对公司的关注！

本文数据来源于深圳证券交易所互动易，仅供参考不构成投资建议。

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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