瑞联新材：公司半导体用光刻胶单体已有多个产品量产

证券之星06-04 16:18

证券之星消息，瑞联新材(688550)06月04日在投资者关系平台上答复投资者关心的问题。

投资者提问：请问瑞联新材是否生产应用于EUV光刻胶和PCB光刻胶的重要原材料？公司产品是否间接应用于先进封装？谢谢。

瑞联新材回复：投资者您好！公司半导体用光刻胶单体已有多个产品量产，在研产品也有数十种，多数为ArF级别，其中一款用于EUV级别的光刻胶单体中试批次已经通过客户验证，待客户生产为光刻胶后再进行性能验证，暂无PCB用光刻胶材料。PSPI单体材料经客户进一步加工后可以用于显示及半导体封装领域。感谢您的关注！

本文数据来源于上海证券交易所e互动，仅供参考不构成投资建议。

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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