宏明电子：可为半导体芯片领域提供陶瓷封装外壳及高可靠被动元件产品

证券之星06-04 20:51

证券之星消息，宏明电子(301682)06月03日在投资者关系平台上答复投资者关心的问题。

投资者提问：您好！请问公司有哪些产品及技术具体应用在芯片、半导体领域的先进封装上？未来公司将如何持续加大技术迭代与市场拓展力度，积极把握半导体国产替代发展机遇，稳步提升相关领域业务规模？谢谢回答。

宏明电子回复：尊敬的投资者，您好！公司可为半导体芯片领域提供陶瓷封装外壳及高可靠被动元件产品，属于半导体封装产业链的上游配套环节，不涉及晶圆厂主导的先进封装技术领域，现阶段该领域收入规模相对较小。未来公司将持续聚焦该领域，稳步推进与市场和技术的深度对接，驱动适配需求的产品与技术升级，稳步扩大相关业务规模。感谢您的关注！

本文数据来源于深圳证券交易所互动易，仅供参考不构成投资建议。

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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