ST亚光：砷化镓信道类MMIC已基本铺齐

证券之星05-29

证券之星消息，ST亚光(300123)05月28日在投资者关系平台上答复投资者关心的问题。

投资者提问：请问公司5G/6G射频前端芯片和光通信芯片研发进展如何！是否有产品应用？

ST亚光回复：尊敬的投资者您好！目前公司射频芯片产品主要是军用品配套，满足内部需求以及整机院所需求，砷化镓信道类MMIC已基本铺齐，具备自主可控的批量供货能力，并可依据用户需求提供定制化多功能芯片开发；氮化镓芯片方面，已开发用于机载平台、弹载平台的功放芯片、驱放芯片、开关芯片等。6G通信技术目前尚处于前沿研究阶段，在军用品领域尚未有大规模应用。公司将密切关注前沿技术的发展和运用，感谢关注。

本文数据来源于深圳证券交易所互动易，仅供参考不构成投资建议。

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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