报道：三星物理AI芯粒芯片明年初流片

环球市场播报05-26

三星电子将从明年起正式推进面向“物理AI（Physical AI）”的半导体平台代工（Foundry）业务。预计公司将与全球电子设计自动化（EDA）及知识产权（IP）企业Cadence Design Systems合作，面向汽车、机器人、工业自动化等多种物理AI应用领域供应半导体产品。　　据业内消息人士26日透露，三星电子与Cadence正在联合开发的“物理AI芯粒半导体平台芯片”，计划于明年...

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