美畅股份：公司产品暂未应用于集成电路后道封装的晶圆划片工序

证券之星05-28

证券之星消息，美畅股份(300861)05月28日在投资者关系平台上答复投资者关心的问题。

投资者提问：公司的产品能否应用于集成电路领域？尤其是硅衬底的划片封装？

美畅股份回复：尊敬的投资者，您好！公司产品金刚线核心应用在光伏硅片切割。在半导体领域，金刚线可用于硅、碳化硅等半导体衬底材料的切片加工，相关业务在整体营收中占比较小。公司产品暂未应用于集成电路后道封装的晶圆划片工序。感谢您的关注！

本文数据来源于深圳证券交易所互动易，仅供参考不构成投资建议。

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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