森霸传感：已在晶圆级封装、芯片级集成等方面形成成熟技术储备

证券之星05-28

证券之星消息，森霸传感(300701)05月28日在投资者关系平台上答复投资者关心的问题。

投资者提问：公司在先进封装领域有布局么

森霸传感回复：尊敬的投资者朋友，您好！非常感谢您对森霸传感的关注和支持。公司的核心产品热释电红外传感器、可见光传感器同属光电传感器范畴，在长期研发与量产过程中，已在晶圆级封装、芯片级集成、光学敏感材料匹配、微光学封装结构等方面形成成熟技术储备。谢谢！

本文数据来源于深圳证券交易所互动易，仅供参考不构成投资建议。

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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