正业科技：公司目前暂无堆叠芯片封装后内部无损检测相关设备

证券之星05-28 15:07

证券之星消息，正业科技(300410)05月28日在投资者关系平台上答复投资者关心的问题。

投资者提问：尊敬的董秘您好，请问咱们公司有堆叠芯片封装后内部无损检测的相关设备吗，单台价值高吗？谢谢了

正业科技回复：尊敬的投资者，您好！公司目前暂无堆叠芯片封装后内部无损检测相关设备，公司生产销售的X-RAY检测设备主要应用于锂电池内部缺陷无损检测，并积极向电子制造等新行业领域拓展。感谢您的关注！

本文数据来源于深圳证券交易所互动易，仅供参考不构成投资建议。

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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