深科技：部分已实现规模化量产

证券之星05-22

证券之星消息，深科技(000021)05月22日在投资者关系平台上答复投资者关心的问题。

投资者提问：年报提到 UFS4.1、GDDR 多芯片倒装、NAND Flash 32D 超高堆叠等高端封装能力。请问这些产品目前处于研发验证、客户导入、小批量还是规模量产阶段？

深科技回复：尊敬的投资者，您好！公司相关产品梯队建设正有序推进，部分已实现规模化量产，稳定向客户批量供货；部分处于研发测试与客户验证阶段。感谢您的关注！

以上内容为证券之星据公开信息整理，不构成投资建议。

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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