台基股份：推进IGBT、SiC等功率半导体模块业务

证券之星05-20 20:52

证券之星消息，台基股份(300046)05月19日在投资者关系平台上答复投资者关心的问题。

投资者提问：请问公司碳化硅芯片产线的实际投产进度和目前的量产良率是否达到了预期目标？距离实现满产满销，目前主要的瓶颈是在上游衬底材料的供应，还是下游客户的认证周期？

台基股份回复：您好！公司按照产品和市场双结构调整优化策略，通过自研合作并购等方式，推进IGBT、SiC等功率半导体模块业务。

以上内容为证券之星据公开信息整理，由AI算法生成（网信算备310104345710301240019号），不构成投资建议。

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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