中际旭创：对PCB介电性能、线宽精度、层数设计、散热能力等技术指标也会有更高要求

证券之星05-17

证券之星消息，中际旭创(300308)05月17日在投资者关系平台上答复投资者关心的问题。

投资者提问：请问公司，1.6T 3.2T等高速率产品对pcb板的要求是否更高？pcb上游的电子布涨价会不会传导至公司的光模块产品压缩公司利润？如果会的话，未来能否通过采用rcc技术的pcb板规避电子布的涨价影响？

中际旭创回复：投资者您好，随着光模块产品持续迭代，对PCB介电性能、线宽精度、层数设计、散热能力等技术指标也会有更高要求，具体影响还需看未来的供需变化、市场竞争态势以及技术进步等因素。感谢关注！

以上内容为证券之星据公开信息整理，由AI算法生成（网信算备310104345710301240019号），不构成投资建议。

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