大族数控：公司专注于PCB及先进封装领域的专用加工设备的研发制造

每日经济新闻05-13

每经AI快讯，有投资者在投资者互动平台提问：先进封装市场快速增长，请问公司在 FOPLP、2.5D/3D 封装等先进封装领域，有哪些设备和技术布局，目前的产业化进展如何？　　大族数控（301200.SZ）5月13日在投资者互动平台表示，公司专注于PCB及先进封装领域的专用加工设备的研发制造，下游终端客户的产品有涉及2.5D/3D封装FC-BGA载板、FOPLP等先进封装；推出的新型激光加工方案、...

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