温州宏丰：蚀刻引线框架是先进半导体封装的核心载体材料

证券之星05-15

证券之星消息，温州宏丰(300283)05月15日在投资者关系平台上答复投资者关心的问题。

投资者提问：请问公司的蚀刻引线框架能否应用于内存、闪存及HBM（高带宽存储）等主流存储芯片的封装中。

温州宏丰回复：尊敬的投资者，您好。蚀刻引线框架是先进半导体封装的核心载体材料。蚀刻工艺凭借微细化加工优势，成为超薄型、高引脚密度引线框架的主流制备方案，特别适用于QFN/DFN 等高密度集成电路封装场景。蚀刻引线框架凭借±5μm级高精度和50μm以下超薄成型能力，在SiP系统级封装、2.5D/3D先进封装领域的需求持续增长。感谢您的关注。

以上内容为证券之星据公开信息整理，由AI算法生成（网信算备310104345710301240019号），不构成投资建议。

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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