金宏气体：高纯二氧化碳主要应用于半导体清洗等工艺环节

证券日报网04-21

证券日报网4月21日讯，金宏气体在接受调研者提问时表示，高纯二氧化碳主要应用于半导体清洗等工艺环节；氧化亚氮主要用于薄膜沉积、化学气相沉积等核心制程环节。海量资讯、精准解读，尽在新浪财经APP

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