台积电展示新一代芯片技术暂不购买阿斯麦最新光刻机

第一财经04-23

台积电周三发布两项芯片制造技术的改进：一项是名为A13的技术，将于2029年投产，可能用于人工智能芯片；另一项是名为N2U的技术，这是一种更经济的选择，可用于制造手机、笔记本电脑以及人工智能芯片。公司计划从其荷兰供应商阿斯麦现有的极紫外光刻机器（EUV）中挖掘更多潜力，而不是转向更新一代的高数值孔径极紫外光刻机（High-NA EUV）。（文章来源：第一财经）

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台积电展示新一代芯片技术 暂不购买阿斯麦最新光刻机

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台积电展示新一代芯片技术暂不购买阿斯麦最新光刻机