世运电路：公司投资15亿元建设“芯创智载”新一代PCB智造基地项目，目前按计划建设中

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证券日报网讯4月16日，世运电路在互动平台回答投资者提问时表示，依据与客户联合开发埋嵌项目日程需求，公司于今年第一季度在现有厂房建成嵌埋PCB产品中试线并投入运作，目前已获得头部客户认可，部分产品已实现小批量生产。公司投资15亿元建设“芯创智载”新一代PCB智造基地项目，目前按计划建设中，预计下半年实现投产。目前嵌埋PCB产品在公司营业收入中的占比极小，公司提请投资者注意风险。海量资讯、精准...

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