宏明电子：公司HTCC陶瓷封装外壳暂未应用于商业火箭

每日经济新闻04-07

每经AI快讯，有投资者在投资者互动平台提问：招股书提到募投项目含HTCC陶瓷封装外壳、高可靠MLCC等；这些产品是否已适配商业火箭的箭体控制、导航、通信系统，并形成小批量/批量供货？宏明电子（301682.SZ）4月7日在投资者互动平台表示，公司HTCC陶瓷封装外壳暂未应用于商业火箭；公司高可靠MLCC产品可配套商业航天项目，但目前公司商业航天领域整体收入规模占比较小，且公司在该领域业务处于起步...

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