英特尔正与亚马逊和谷歌洽谈布局AI芯片封装

环球市场播报04-07

英特尔已与亚马逊和谷歌就使用这家芯片制造商的先进封装服务进行了持续讨论。　　这些讨论表明，英特尔正努力为其封装技术争取外部客户，这是其代工业务的关键组成部分。报道援引一位英特尔前员工的话称，与台积电的方案相比，英特尔的EMIB和EMIB-T封装方法设计得更加节能且节省空间。　　人工智能推动了对先进芯片封装的需求。英特尔代工业务负责人纳加·钱德拉塞卡兰表示，封装可能会在未来十年改变人工智能革命。...

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英特尔正与亚马逊和谷歌洽谈 布局AI芯片封装

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英特尔正与亚马逊和谷歌洽谈布局AI芯片封装