台积电硅光整合平台今年量产或成为光通信关键底座

格隆汇04-01

近日，SEMI国际半导体产业协会旗下硅光子产业联盟SiPhIA举办论坛。会上，台积电指出，旗下硅光整合平台COUPE预计今年进入量产，成为推动共封装光学（CPO）落地的关键里程碑，标志着AI光通信正式进入产业化倒数阶段。台积电表示，晶圆测试、光纤阵列单元与高速光学封装组装三大环节的技术突破，将是决定CPO能否顺利规模化的关键。西部证券评价道，台积电的COUPE封装平台正在成为CPO系统化的关键...

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台积电硅光整合平台今年量产 或成为光通信关键底座

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台积电硅光整合平台今年量产或成为光通信关键底座