消息称高通、联发科合计减产约1500~2000万颗4nm移动处理器

IT之家04-02

IT之家 4 月 2 日消息，台媒《工商时报》早些时候曾称联发科已开始下调在晶圆代工厂的 4nm 工艺晶圆投片量；而根据另一家台媒《电子时报》的消息，高通也了加入减产行列。报道指出，联发科与高通合计削减的 4nm 手机芯片规模达 1500~2000 万颗，相当于 2~3 万片晶圆，显示智能手机市场已出现明显降温迹象。搭载 4nm 高通骁龙 8s Gen4 芯片的一加 Turbo 6主 SoC 产能...

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