耐科装备(688419.SH)：用部分募集资金4161万元投资建设“基于先进封装的半导体封装装备制造升级技改项目”

中金财经03-20

格隆汇3月20日丨耐科装备(688419.SH)公布，公司于2026年3月20日召开了2026年度第二次董事会审计委员会会议、第五届董事会第十七次会议，审议通过了《关于使用结余募集资金投资建设新项目的议案》，同意将公司首次公开发行股票募集资金投资项目“半导体封装装备新建项目”结余的部分募集资金4,161.00万元(含利息及现金管理收益)投资建设“基于先进封装的半导体封装装备制造升级技改项目”。

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