广合科技启动招股瑞银、保诚等参投1.9亿美元

IT桔子03-13

广合科技是一家线路板生产商，依托HDI、混压、盲锣、背钻、埋铜块等技术，为用户高密度精密互连线路板、以及含HDI结构软硬结合板等产品，广泛应用于汽车、移动终端、消费电子、电脑、服务器等领域。本次发行吸引了多家境内外知名机构作为基石投资者参与，包括源峰基金、香港景林、瑞银资产管理新加坡公司、保诚（02378.HK）、大湾区共同家园投资有限公司、惠理、霸菱及大家人寿等。基石投资者已承诺按发售价认购总额...

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广合科技启动招股 瑞银、保诚等参投1.9亿美元

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广合科技启动招股瑞银、保诚等参投1.9亿美元