AMD苏姿丰将首次访韩，或为保障HBM与晶圆代工供应

芯智讯03-13 09:15

3月12日消息，据韩国媒体报道，美国处理器大厂AMD CEO 苏姿丰预计将于3月18日飞往韩国，与当地重要供应链合作伙伴及科技巨头高层展开会晤。据悉，这是苏姿丰自2014年出任AMD CEO以来首次访问韩国，凸显了在当前全球最大规模的人工智能（AI）基础设施建设浪潮下，AMD对于保障其核心供应链产能的急迫性与决心。报道指出，苏姿丰预计将会与韩国三星电子会长李在镕，以及韩国网络巨头Naver CEO...

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CEO以来首次访问韩国，凸显了在当前全球最大规模的人工智能（AI）基础设施建设浪潮下，AMD对于保障其核心供应链产能的急迫性与决心。报道指出，苏姿丰预计将会与韩国三星电子会长李在镕，以及韩国网络巨头Naver CEO崔秀妍。此外，也可能将拜访SK海力士高层。针对此次会晤，预计将深入探讨数据中心领域的合作计划，并针对新一代AI基础设施的布局进行战略性交流。随着AMD积极迈向下一代AI基础设施的能力发展，该公司已展现出强烈的企图心。除了准备推出Instinct MI400系列产品以正面迎战竞争对手英伟达（NVIDIA）外，AMD在服务器中央处理器（CPU）领域也取得巨大的进展，这使得AMD有足够的底气，在代理型AI（agentic AI）市场中与英伟达展开更具侵略性的竞争。为了确保能满足客户与日俱增的庞大需求，苏姿丰此次亲自出马，势在将关键的供应链伙伴紧密拉拢至AMD的阵营中。其中，在与三星会长李在镕的关键会议中，双方的讨论焦点将高度集中于内存与晶圆代工领域。长久以来，超威一直是三星高带宽内存（HBM）业务的关键客户，更是首批成功从这家韩国巨头手中取得HBM3E供应的厂商之一。展望未来，AMD也预期将成为三星HBM4产能配置中不可或缺的重要一环。然而，市场局势正在发生变化。三星的HBM业务如今也已成为英伟达供应链的重要组成部分，这意味着AMD若想如过去一般轻松取得所需的理想产能，将面临更高的难度与竞争压力。因此，如何确保稳定的内存供应，无疑是苏姿丰此次韩国行的首要任务。除了内存供应，AMD与三星在晶圆代工领域的合作关系也传出将进一步深化。据报导，双方已针对超威未来的EPYC Venice CPU所需的2nm先进制程芯片合作展开讨论。这项发展深刻表明，在AMD未来的营运蓝图中，韩国供应链伙伴的参与度将大幅提升，这也是为何苏姿丰上任AMD CEO十多年后的韩国之行具有重大意义。事实上，在当前AI芯片市场中，AMD正面临着一个严峻的竞争环境，其最大竞争对手英伟达极度偏好利用“限制”（constraints）来维持市场主导权，并对整体供应链拥有极为严格的掌控力。正如英伟达CEO黄仁勋去年多次访问中国台湾与韩国、积极会晤供应链高层以确保当前与未来产品的产能优势。如今，在AI供应链的布局上，苏姿丰也转向主动。因此，苏姿丰希望通过这次具有里程碑意义的韩国之行，打破竞争对手在供应链上的钳制，深化与亚洲顶尖科技巨头的结盟关系。编辑：芯智讯-林子","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"corporation","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":false,"code":"91000000","status":"200"},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; 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