AI芯片版图大洗牌：博通锁定至2028年台积电先进制程与HBM产能

全球半导体观察03-10

随着全球人工智能（AI）产业呈现爆发式增长，芯片供应链的稳定性已成为各大科技巨头争夺的终极焦点。在这样的产业背景下，ASIC芯片大厂博通（Broadcom）抛出重磅消息，正式对外宣布已成功确保至2028年的高带宽内存（HBM）供应以及台积电（TSMC）先进制程的产能。此消息公布后，不仅消除了外界对于AI产业可能受制于存储器供应短缺与台积电产能瓶颈的担忧，更宣告了博通在特殊应用集成电路（ASIC）...

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