研报 | 英伟达算力架构为Scale-Up光互连发展铺路，预估CPO于AI数据中心渗透率将逐年提升

全球半导体观察03-11

根据TrendForce集邦咨询最新高速互连市场研究，NVIDIA（英伟达）下一代的AI算力柜架构显示，未来GPU设计重心将转向更高密度的芯片互连，以及更高速的数据传输，机柜内芯片互连(Scale-Up)及跨机柜的大规模互连(Scale-Out)将成为规划数据中心的核心课题。使用铜缆的传统电气传输方案，受物理限制无法应对超大规模的数据搬运需求，光学传输方案因此获得发展空间。TrendForce集邦...

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optical interconnection, and it is estimated that the penetration rate of CPO in AI data center will increase year by year","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"NVDU":0.6,"NVDW":0.6,"NVDS":0.6,"NVDY":0.6,"2NVD.UK":0.6,"NVDX":0.6,"NVDQ":0.6,"NVII":0.6,"NVD":0.6,"NVDA":1.95,"NVDS.UK":0.6,"NVD2.UK":0.6,"3NVD.UK":0.6,"NVDG":0.6,"NVDD":0.6,"DIPS":0.6,"ANV":0.6,"NVD3.UK":0.6,"NVDB":0.6,"NVIW.SI":0.6,"SNVD.UK":0.6},"content_text":"根据TrendForce集邦咨询最新高速互连市场研究，NVIDIA（英伟达）下一代的AI算力柜架构显示，未来GPU设计重心将转向更高密度的芯片互连，以及更高速的数据传输，机柜内芯片互连(Scale-Up)及跨机柜的大规模互连(Scale-Out)将成为规划数据中心的核心课题。使用铜缆的传统电气传输方案，受物理限制无法应对超大规模的数据搬运需求，光学传输方案因此获得发展空间。TrendForce集邦咨询预估，CPO(共同封装光学)在AI数据中心光通信模块的渗透率将逐年成长，有机会于2030年达35%。依照NVIDIA NVLink 6的传输通信协定，其定义单通道400G SerDes的极速，以及单颗GPU拥有3.6 TB/s的带宽极限。在极端的高频传输速率下，铜缆方案电信号随传输距离增加而衰退的情况加剧，导致可用距离被严格限缩在一米内。然而，当芯片互连规模放大，Scale-Up串联规模从单一机柜扩展至跨机柜(如NVIDIA八组NVL72组成之576 GPU集群)，铜缆方案将无法应付需求。此外，光学传输具备WDM(波分复用)技术，能利用多种波长在单一光纤内大幅提升传输密度，是铜缆传输无法企及的优势。因此，各大云端供应商(CSP)正携手新创公司研发各项光学传输方案，为将来更大的带宽需求作准备，也替CPO技术的渗透与成长前景奠定基础。产业龙头深化布局，算力基础建设对光学技术依赖将加深观察NVIDIA近年在CPO与硅光技术的策略，在半导体封装端，NVIDIA通过TSMC （台积电） COUPE 3D封装技术，堆栈逻辑与硅光芯片，并利用硅光芯片上的200G PAM4微环调变器(MRM)，兼顾小体积与低功耗，提升光引擎的整体带宽密度。NVIDIA近日也宣布分别投资Lumentum与Coherent各20亿美元，并签署多年度采购承诺，以及先进激光、光学产品的优先供货权。此举显示NVIDIA开始针对Scale-Up光互连的关键零部件预先做战略储备，将深度参与激光与光学元件研发，意味未来的算力基础设施将更依赖光学技术。TrendForce集邦咨询预期，基于硅光与CPO的光互连技术，将率先导入在NVIDIA Rubin 世代机柜间数据传输的Scale- Out，并规划将光互连整合至未来的Scale-up互连架构中，以实现更高的带宽密度。据TrendForce集邦咨询估计，2026年用于AI数据中心的光通信模块中，CPO渗透率仅约0.5%。随着硅光与CPO封装技术逐渐纯熟，跨机柜的Scale-Up光互连数据传输最快将于Rubin Ultra或Feynman世代开始出现。在数据传输带宽不断提高的情况下，TrendForce集邦咨询预估至2030年左右，硅光CPO于AI数据中心的渗透率有机会达到35%水平。同时，新型态的光互连与Optical I/O等光学技术也可能陆续出现。#CPO #共同封装光学 #英伟达 #数据中心▶关于我们TrendForce集邦咨询是一家专注全球高科技产业深度分析与顾问咨询服务的国际研究机构。研究领域横跨晶圆代工、AI服务器、DRAM、HBM、NAND 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