恩智浦发布i.MX 93W 计划下半年提供样品

格隆汇03-10

据界面，恩智浦半导体正式推出i.MX 93W应用处理器。作为首款将专用AI神经处理器（NPU）与安全三频无线连接功能集成到单一封装中的应用处理器，该SoC专为加速物理AI的部署而设计。其高集成度设计可替代达60个分立元件，集成了可扩展的边缘计算、AI加速和安全无线连接能力。据悉，i.MX 93W预计于2026年下半年开始提供样品。

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