英特尔先进封装，强势崛起

半导体芯闻03-09

如果您希望可以时常见面，欢迎标星收藏哦~人工智能（AI）芯片需求快速攀升，使半导体产业的先进封装技术成为关键环节。市场传出，因台积电先进封装CoWoS产能长期吃紧，部分AI芯片客户开始评估其他方案，英特尔主打的EMIB封装技术因此受到关注。外媒近日报导指出，相关合作案规模上看每年数十亿美元，显示先进封装市场竞争正逐渐升温。根据Wccftech等外媒报导指出，随着AI运算需求持续扩大，高效能芯片...

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{"i18n":{"language":"zh_CN"},"isChannel":false,"data":{"share":"https://www.laohu8.com/m/news/2618629248?lang=zh_CN&edition=full","thumbnail":"","is_english":false,"pubTime":"2026-03-09 18:32","share_image_url":"https://static.laohu8.com/9a95c1376e76363c1401fee7d3717173","id":"2618629248","market":"us","top_or_hot":-1,"title":"英特尔先进封装，强势崛起","media":"半导体芯闻","content":"<div>\n<p>如果您希望可以时常见面，欢迎标星 收藏哦~人工智能（AI）芯片需求快速攀升，使半导体产业的先进封装技术成为关键环节。市场传出，因台积电先进封装CoWoS产能长期吃紧，部分AI芯片客户开始评估其他方案，英特尔主打的EMIB封装技术因此受到关注。外媒近日报导指出，相关合作案规模上看每年数十亿美元，显示先进封装市场竞争正逐渐升温。根据Wccftech等外媒报导指出，随着AI运算需求持续扩大，高效能芯片...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260309210836954612b1&s=b\">网页链接</a>\n\n</div>\n","source":"tencent","html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>英特尔先进封装，强势崛起</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\n英特尔先进封装，强势崛起\n</h2>\n\n<h4 class=\"meta\">\n\n\n2026-03-09 18:32 北京时间&nbsp;&nbsp;&nbsp;<a href=http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260309210836954612b1&s=b><strong>半导体芯闻</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>如果您希望可以时常见面，欢迎标星 收藏哦~人工智能（AI）芯片需求快速攀升，使半导体产业的先进封装技术成为关键环节。市场传出，因台积电先进封装CoWoS产能长期吃紧，部分AI芯片客户开始评估其他方案，英特尔主打的EMIB封装技术因此受到关注。外媒近日报导指出，相关合作案规模上看每年数十亿美元，显示先进封装市场竞争正逐渐升温。根据Wccftech等外媒报导指出，随着AI运算需求持续扩大，高效能芯片...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260309210836954612b1&s=b\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"04335","symbol_name":"英特尔-T","start_time":0,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260309210836954612b1&s=b","article_id":"2618629248","we_media_id":null,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260309210836954612b1&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"url":"https://stock-news.laohu8.com/highlight/detail?id=2618629248","pubTimestamp":1773052323,"columns":[],"sourceInfo":{"source_id":"tencent","name":"腾讯"},"weMediaInfo":null,"summary":"市场传出，因台积电先进封装CoWoS产能长期吃紧，部分AI芯片客户开始评估其他方案，英特尔主打的EMIB封装技术因此受到关注。英特尔对此则积极推广自家EMIB与EMIB-T封装方案。产业人士指出，台积电与英特尔在先进封装的技术路径上各具特色。市场传出，包括英伟达、Google及Meta在内的科技巨头，开始评估在下一代AI ASIC或加速器中导入英特尔的方案，先进封装竞局或将成形。","collect":0,"end_time":0,"defaultTopTitle":"qq.com","property":[],"viewcount":null,"language":"zh","relate_stocks":{"04335":"英特尔-T","BK4533":"AQR资本管理(全球第二大对冲基金)","LU2148611432.USD":"AZ ALLOCATION BALANCED BRAVE \"AAZ\" (USDHDG) ACC","BK4529":"IDC概念","BK4602":"量子计算概念","BK4575":"芯片概念","LU0081259029.USD":"UBS (LUX) EQUITY FUND - TECH OPPORTUNITY \"P\" (USD) ACC","LU2543165471.USD":"E FUND (HK) GLOBAL QUALITY GROWTH \"A\" (USD) ACC","BK4535":"淡马锡持仓","BK4515":"5G概念","BK4612":"AI芯片","LU2931357623.SGD":"MANULIFE GF GLOBAL SEMICONDUCTOR OPPORTUNITIES \"AA\" (SGDHDG) ACC","BK4588":"碎股","BK4550":"红杉资本持仓","BK4579":"人工智能","INTW":"2倍做多INTC ETF-GraniteShares","LU0097036916.USD":"贝莱德美国增长A2 USD","BK4605":"半导体精选","BK4534":"瑞士信贷持仓","LU0321505868.SGD":"Schroder ISF Global Dividend Maximiser A Dis SGD","LU0321505439.SGD":"Schroder ISF Global Dividend Maximiser A Acc SGD","IE000M9KFDE8.USD":"NEUBERGER BERMAN US LARGE CAP VALUE \"A\" (USD) ACC","INTC":"英特尔","BK4554":"元宇宙及AR概念","BK4512":"苹果概念","BK4543":"AI","BK4527":"明星科技股","LU0274383776.USD":"MANULIFE GF US SMALL CAP EQUITY \"AA\" (USD) INC","LU2089985449.USD":"MANULIFE GF GLOBAL SEMICONDUCTOR OPPORTUNITIES \"AA\" (USD) ACC","LINT":"Direxion Daily INTC Bull 2X ETF","BK4585":"ETF&股票定投概念","BK4141":"半导体产品"},"translate_title":"Intel Advanced Packaging, Strong Rise","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"INTC":1.96,"LINT":0.6,"04335":1.96,"INTW":0.6},"content_text":"如果您希望可以时常见面，欢迎标星 收藏哦~人工智能（AI）芯片需求快速攀升，使半导体产业的先进封装技术成为关键环节。市场传出，因台积电先进封装CoWoS产能长期吃紧，部分AI芯片客户开始评估其他方案，英特尔主打的EMIB封装技术因此受到关注。外媒近日报导指出，相关合作案规模上看每年数十亿美元，显示先进封装市场竞争正逐渐升温。根据Wccftech等外媒报导指出，随着AI运算需求持续扩大，高效能芯片不仅依赖先进制程，封装技术同样攸关效能表现。其中台积电CoWoS封装可整合GPU与高频宽记忆体（HBM），提供高速资料传输能力，已成为多家AI芯片设计公司采用的关键技术，但在AI需求爆发下，CoWoS产能长期满载，短期内供应仍相对紧绷。英特尔对此则积极推广自家EMIB与EMIB-T封装方案。英特尔财务长David Zinsner近期向投资人表示，市场对相关封装技术的兴趣明显提升，原本公司预期相关订单规模仅落在数亿美元，但随着客户洽谈进展，目前已有多项合作案接近每年数十亿美元等级，需求明显高于先前预期。产业人士指出，台积电与英特尔在先进封装的技术路径上各具特色。台积电的CoWoS采用完整“硅中介层”作为芯片互连平台，具备极高的频宽表现，但缺点在于硅材料使用量大、成本较高且扩产周期长。相比之下，英特尔的EMIB透过局部“硅桥”架构，仅在需要高速互连的特定区域嵌入硅片。这种做法不仅能维持高效能传输，更能降低材料成本与封装尺寸，并在设计弹性上展现优势。由于大型云端服务供应商（CSP）积极开发自有AI芯片，让先进封装重要性不亚于晶圆制造。市场传出，包括英伟达（NVIDIA）、Google及Meta在内的科技巨头，开始评估在下一代AI ASIC或加速器中导入英特尔的方案，先进封装竞局或将成形。（来源：半导体芯闻综合）","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":false,"code":"91000000","status":"200"},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; +claudebot@anthropic.com)","isDev":false,"isTTM":false,"tenantId":"TBCN","deviceId":"web-server-community-laohu8-v3","version":"4.36.2","shortVersion":"4.36.2","platform":"web","vendor":"web","appName":"laohu8","isIOS":false,"isAndroid":false,"isTiger":false,"isTHS":false,"isWeiXin":false,"isWeiXinMini":false,"isWeiBo":false,"isQQ":false,"isBaiduSwan":false,"isBaiduBox":false,"isDingTalk":false,"isToutiao":false,"isOnePlus":false,"isHuaWei":false,"isXiaomi":false,"isXiaomiWebView":false,"isOppo":false,"isVivo":false,"isSamsung":false,"isMobile":false},"href":"/m/news/2618629248","isCrawlerRequest":true}