台积电，大单不断

半导体芯闻03-09 18:32

如果您希望可以时常见面，欢迎标星收藏哦~随着全球人工智能（AI）产业呈现爆发性成长，芯片供应链的稳定性已成为各大科技巨头争夺的终极焦点。在这样的产业背景下，ASIC 芯片大厂博通（Broadcom）投下震撼弹，正式对外宣布已成功确保至2028 年的高频宽记忆体（HBM）供应以及台积电（TSMC）先进制程的产能。在此消息公布后，不仅彻底消除了外界对于AI产业可能受制于记忆体供应短缺与台积电产能瓶颈...

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