英特尔“Panther Lake - H”移动端处理器细节大曝光，采用分离式芯片设计

IT之家03-09

IT之家 3 月 8 日消息，据 TechPower Up 昨天报道，半导体深度分析平台 Kurnal Insights 最近放出了英特尔“Panther Lake-H”移动端处理器的 Die-Shot 照片。▲ 图源：Kurnal Insights，下同从照片中我们可以看到，“Panther Lake-H”处理器采用分离式芯片设计，整体样貌类似前代产品 Arrow Lake-H 和 Meteor...

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H”移动端处理器细节大曝光，采用分离式芯片设计\n</h2>\n\n<h4 class=\"meta\">\n\n\n2026-03-09 10:27 北京时间&nbsp;&nbsp;&nbsp;<a href=http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260309103604a459e5dd&s=b><strong>IT之家</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>IT之家 3 月 8 日消息，据 TechPower Up 昨天报道，半导体深度分析平台 Kurnal Insights 最近放出了英特尔“Panther Lake-H”移动端处理器的 Die-Shot 照片。▲ 图源：Kurnal Insights，下同从照片中我们可以看到，“Panther Lake-H”处理器采用分离式芯片设计，整体样貌类似前代产品 Arrow Lake-H 和 Meteor...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260309103604a459e5dd&s=b\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"LU0097036916.USD","symbol_name":"贝莱德美国增长A2 USD","start_time":0,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260309103604a459e5dd&s=b","article_id":"2618615497","we_media_id":null,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260309103604a459e5dd&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"url":"https://stock-news.laohu8.com/highlight/detail?id=2618615497","pubTimestamp":1773023268,"columns":[],"sourceInfo":{"source_id":"tencent","name":"腾讯"},"weMediaInfo":null,"summary":"IT之家 3 月 8 日消息，据 TechPower Up 昨天报道，半导体深度分析平台 Kurnal Insights 最近放出了英特尔“Panther Lake-H”移动端处理器的 Die-Shot 照片。其中，SoC Tile 采用英特尔 18A 制程工艺打造，而在主流型号中，Graphics Tile 只包含 4 个 Xe 核心并采用 Intel 3 工艺、I/O Tile 使用上一代相同的 N6 制程。对比之下 Panther Lake-U 处理器的 Graphics Tile 带有 12 个 Xe 核心，采用台积电 N3E 工艺制造。","collect":0,"end_time":0,"defaultTopTitle":"qq.com","property":[],"viewcount":null,"language":"zh","relate_stocks":{"LU0097036916.USD":"贝莱德美国增长A2 USD","BK4554":"元宇宙及AR概念","LINT":"Direxion Daily INTC Bull 2X ETF","LU0321505439.SGD":"Schroder ISF Global Dividend Maximiser A Acc SGD","LU0321505868.SGD":"Schroder ISF Global Dividend Maximiser A Dis SGD","BK4543":"AI","BK4512":"苹果概念","BK4527":"明星科技股","IE000M9KFDE8.USD":"NEUBERGER BERMAN US LARGE CAP VALUE \"A\" (USD) ACC","04335":"英特尔-T","BK4141":"半导体产品","BK4585":"ETF&股票定投概念","BK4534":"瑞士信贷持仓","INTW":"2倍做多INTC ETF-GraniteShares","BK4533":"AQR资本管理(全球第二大对冲基金)","BK4602":"量子计算概念","BK4529":"IDC概念","LU0274383776.USD":"MANULIFE GF US SMALL CAP EQUITY \"AA\" (USD) INC","LU2089985449.USD":"MANULIFE GF GLOBAL SEMICONDUCTOR OPPORTUNITIES \"AA\" (USD) ACC","BK4575":"芯片概念","LU2931357623.SGD":"MANULIFE GF GLOBAL SEMICONDUCTOR OPPORTUNITIES \"AA\" (SGDHDG) ACC","BK4535":"淡马锡持仓","LU2148611432.USD":"AZ ALLOCATION BALANCED BRAVE \"AAZ\" (USDHDG) ACC","BK4612":"AI芯片","BK4515":"5G概念","LU0081259029.USD":"UBS (LUX) EQUITY FUND - 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