布局下一代光通信技术联电牵手哈佛系初创量产TFLN平台

格隆汇03-12

晶圆代工厂联电(UMC)周四宣布，与来自哈佛大学纳米光学实验室的创业企业HyperLight建立制造伙伴关系，加速量产后者的TFLN Chiplet(薄膜铌酸锂芯片)平台。该材料被视为下一代光互连核心技术，可实现更高带宽、更低功耗，目标应用于AI数据中心高速通信。

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布局下一代光通信技术 联电牵手哈佛系初创量产TFLN平台

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布局下一代光通信技术联电牵手哈佛系初创量产TFLN平台