苹果又搞了一个创新：CPU、GPU分开设计，再封装在一起

Ofweek维科网03-06

说起现在的ARM芯片，不管是手机Soc，还是电脑用的芯片，都是CPU、GPU设计在一起的，然后集成在一颗芯片了。而手机Soc里面则集成更多的东西，有CPU、GPU、DSP、ISP、NPU，基带芯片等等。这样的好处是高度集成化，提高芯片之间的数据传输速度。但是，随着芯片越来越强，工艺越来越先进，比如3nm、2nm、1nm这样的工艺下，这种设计也带来一个问题，那就是设计难度越来越高，因为晶体管越来越多...

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href=http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260306160306a4533a39&s=b><strong>Ofweek维科网</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>说起现在的ARM芯片，不管是手机Soc，还是电脑用的芯片，都是CPU、GPU设计在一起的，然后集成在一颗芯片了。而手机Soc里面则集成更多的东西，有CPU、GPU、DSP、ISP、NPU，基带芯片等等。这样的好处是高度集成化，提高芯片之间的数据传输速度。但是，随着芯片越来越强，工艺越来越先进，比如3nm、2nm、1nm这样的工艺下，这种设计也带来一个问题，那就是设计难度越来越高，因为晶体管越来越多...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260306160306a4533a39&s=b\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"LU1935042215.USD","symbol_name":"MANULIFE GF GLOBAL MULTI-ASSET DIVERSIFIED INCOME  \"AA\" (USD) INC 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Max芯片上，就采用了CPU、GPU分开的模式，设计是就分开设计，制造时也不再集成一颗芯片里，而是分离式。想当初，苹果在芯片中，首次将DRAM内存封装芯片之中，后来又是利用互边技术将多颗芯片封装在一起，如今又是将CPU、GPU分离，很多办法，都是苹果首创。","collect":0,"end_time":0,"defaultTopTitle":"qq.com","property":[],"viewcount":null,"language":"zh","relate_stocks":{"LU1935042215.USD":"MANULIFE GF GLOBAL MULTI-ASSET DIVERSIFIED INCOME  \"AA\" (USD) INC A","LU2458330243.SGD":"FRANKLIN SHARIAH TECHNOLOGY \"A-H1\" (SGDHDG) ACC","LU2750360641.GBP":"INVESCO GLOBAL EQUITY INCOME ADVANTAGE \"A\" (GBPHDG) INC","IE000KEQY171.SGD":"PIMCO BALANCED INCOME AND GROWTH \"M\" (SGDHDG) INC","LU2750360997.AUD":"INVESCO GLOBAL EQUITY INCOME ADVANTAGE \"A\" (AUDHDG) INC","LU2023251221.USD":"ALLIANZ GLOBAL SUSTAINABILITY \"AM\" (USD) INC","LU0354030511.USD":"ALLSPRING  U.S. LARGE CAP GROWTH \"I\" (USD) ACC","LU0354030438.USD":"富国美国大盘成长基金Cl A Acc","LU1571399168.USD":"ALLSPRING GLOBAL LONG/SHORT EQUITY \"IP\" (USD) ACC","LU1582986359.USD":"M&G (LUX) INCOME ALLOCATION \"A-H\" (USDHDG) ACC","LU2106854487.HKD":"ALLIANZ THEMATICA 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together","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"AAPU":0.6,"AAPB":0.6,"AAPY":0.6,"AAPX":0.6,"MACW.SI":0.6,"AAPD":0.6,"APLY":0.6,"AAPW":0.6,"AAPL":1.95},"content_text":"说起现在的ARM芯片，不管是手机Soc，还是电脑用的芯片，都是CPU、GPU设计在一起的，然后集成在一颗芯片了。而手机Soc里面则集成更多的东西，有CPU、GPU、DSP、ISP、NPU，基带芯片等等。这样的好处是高度集成化，提高芯片之间的数据传输速度。但是，随着芯片越来越强，工艺越来越先进，比如3nm、2nm、1nm这样的工艺下，这种设计也带来一个问题，那就是设计难度越来越高，因为晶体管越来越多的，出错的机率会大增。同时在制造时，因为晶体管越多，结构就越复杂，制造难度也会大大的增加，那么率良就会降低。此外，现在的芯片性能越强，发热越大，当众多的结构放到一起时，热量控制也越来越难了。在这样的背景之下，近日，苹果搞了一个大创新，那就是将CPU、GPU分开设计，然后再封装在一起。苹果在近日发布的M5 Pro和M5 Max芯片上，就采用了CPU、GPU分开的模式，设计是就分开设计，制造时也不再集成一颗芯片里，而是分离式。然后制造好后，再通过先进封装技术，封装在一起，CPU、GPU可以独立运行，但又协同处理计算任务。按照专业人士的说法，这种模式，降低设计时的难度，也降低了制造时的难度，改善制造时的良率，还能够降低功耗，控制散热，用到设备中时，表现会更好而通过芯片级的封装技术，比如M5 ProM5 Max，采用的是是台积电的SoIC-MH封装技术，又在晶圆层级将多个芯片直接整合在一起，不会影响数据传输速度。专业人士认为，一旦苹果开了这个头，且证明这种方式更为科学，那么接下来行业内可能大家都会跟着苹果学，那么这种分离式设计，将成为未来先进芯片的一种主流。想当初，苹果在芯片中，首次将DRAM内存封装芯片之中，后来又是利用互边技术将多颗芯片封装在一起，如今又是将CPU、GPU分离，很多办法，都是苹果首创。可见，苹果如今在芯片领域，也已经是一家举足轻重的企业了，一举一动，或能引发全行业的潮流。","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"","news_rank":0,"isVideo":false,"video":null,"symbols":[],"gpt_button":0,"need_auth":false,"need_login_tip":false,"code":"91000000","status":"200"},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; 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